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Integrated Passive Component TechnologyFrom Wiley-IEEE Press
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- This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology.
- Describes the processes available for creating integrated passives, measuring their properties, and applying them.
- Brings reader up to date in a fast-moving technology.
- Enables reader to implement the technology into a manufacturing environment.
- Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI.
- Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
- Sales Rank: #4904722 in Books
- Published on: 2003-06-30
- Original language: English
- Number of items: 1
- Dimensions: 9.65" h x .95" w x 6.38" l, 1.50 pounds
- Binding: Hardcover
- 379 pages
Review
"…a comprehensive look at the reasons and current challenges…[of integrating] passive devices into board or IC…just the right dose of the math to explain the physics and theory behind the technology." (IEEE Circuits & Devices Magazine, Jan/Feb 2005)
"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)
From the Back Cover
An important real-world look at the status and future of integrated passives
This book provides an overview of the technology, potential applications, motivations, and problems associated with integrating resistors, capacitors, and inductors into circuit boards instead of mounting them as discrete components on the surface. Written primarily for engineers and scientists in industry who want to determine if passive integration is a viable option for a particular product, the text describes the processes available for designing and fabricating integrated passives, measuring their properties, and applying them to microelectronic systems.
In order to bring professionals up to date in this fast-moving technology and enable them to implement it into their own manufacturing environments, the editors address some basic questions concerning the tradeoffs between discrete and integrated approaches, including:
- What are the advantages and disadvantages of integrated passives?
- Is this processing compatible with existing substrates?
- Can integrated passives be made with conventional PWB fabrication equipment?
- How do the electrical characteristics of integrated passives differ from discretes?
- How are integrated passives designed?
- What must be considered in the economic analysis?
Integrated Passive Component Technology is the first book dedicated to this subject. A comprehensive survey of the state of the art, it will be an invaluable resource for engineers and materials scientists in the microelectronics industry. Interdisciplinary issues are presented in clearly delineated sections throughout the book so readers can pick those parts that are most beneficial to them.
About the Author
RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society’s Dielectric Science and Technology Division.
LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.
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